1. Please upload the Gerber & BOM Files and board making instructions
2. The uploaded file format supports ZIP, RAR, 7Z compression package, less than 50MB
1. Please upload the Gerber Files and board making instructions
1. Please upload the BOM Files
Discover bqpwb’s RF antenna PCB, engineered for superior performance in radio frequency applications. Our PCBs are designed to enhance signal quality and reliability, offering optimal solutions for RF and antenna technologies.
Fixture Test Board Material: R-5775G Impedance tolerance: +/-5% 8 layers 1-step HDI 1+N+1 HDI Surface Finish: ENIG + Back drill
Product Details
High Speed Server VPX Material: R-5785 18 layers 3-step HDI 3+N+3 HDI Thickness: 2.0 mm Minimum hole size: 0.2 mm Hole-to-line distance: 0.15 mm Minimum line width/spacing: 0.08/0.08 mm Surface Finish: Nickel plated palladium + Back
Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f
Converter Domain: Converter domain 30 layers Crimping hole, Impedance Minimum line width / line spacing: 0.1/0.1mm
Converter Domain 30 layers Crimping hole, Impedance Minimum line width / line spacing: 0.1/0.1 mm
Application: Semiconductor Test Product Features: 28-layer, extra-large size Material: S1000-2M Layers: 28 Board Thickness: 4.0 mm Minimum Hole Size: 0.4 mm Minimum Line Width/Spacing: 6/5 mil Surface Finish: Gold plating
ServerVPXBackplane Material:S1000-2M 18layers BoardThickness:5.0mm MinimumHoleSize:0.5mm Hole-to-LineDistance:0.15mm SurfaceFinish:ENIG
ADAS for Automobile Driving Data Acquisition System Material: R-5725S 16 layers Board Thickness: 2.1 mm Minimum Hole Size: 0.2 mm Hole-to-Line Distance: 0.15 mm Minimum Line Width/Spacing: 0.075/0.09 mm
Semiconductor Field Test Probe Card 34 layers Board Thickness: 6.5 mm Minimum Hole Size: 0.5 mm Gold Thickness: 30
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