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Automotive PCB Assembly

Explore bqpwb’s automotive PCB assembly solutions designed for precision and reliability. We specialize in high-quality PCB assemblies tailored for the automotive industry, ensuring robust performance and compliance with industry standards. Discover

Automotive PCB Assembly

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PCBA Board Assembly 99

PCBA Board Assembly 99

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Product Details
PCBA Board Assembly 98

PCBA Board Assembly 98

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 97

PCBA Board Assembly 97

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 96

PCBA Board Assembly 96

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 95

PCBA Board Assembly 95

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 94

PCBA Board Assembly 94

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 93

PCBA Board Assembly 93

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 92

PCBA Board Assembly 92

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 91

PCBA Board Assembly 91

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 90

PCBA Board Assembly 90

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 89

PCBA Board Assembly 89

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 88

PCBA Board Assembly 88

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 87

PCBA Board Assembly 87

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 86

PCBA Board Assembly 86

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 85

PCBA Board Assembly 85

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 84

PCBA Board Assembly 84

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
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