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Communication PCB Assembly

bqpwb specializes in communication PCB assembly, providing reliable and advanced solutions for electronic communication devices. Our expert team ensures high-quality assembly and performance, meeting the demands of modern communication technology. Ex

Communication PCB Assembly

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PCBA Board Assembly 79

PCBA Board Assembly 79

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 78

PCBA Board Assembly 78

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 77

PCBA Board Assembly 77

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 76

PCBA Board Assembly 76

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 75

PCBA Board Assembly 75

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 74

PCBA Board Assembly 74

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 73

PCBA Board Assembly 73

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 72

PCBA Board Assembly 72

a2 Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surfac

Product Details
PCBA Board Assembly 71

PCBA Board Assembly 71

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 70

PCBA Board Assembly 70

Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f

Product Details
PCBA Board Assembly 69

PCBA Board Assembly 69

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 68

PCBA Board Assembly 68

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 67

PCBA Board Assembly 67

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 66

PCBA Board Assembly 66

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 65

PCBA Board Assembly 65

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
PCBA Board Assembly 64

PCBA Board Assembly 64

Point Components type PCB size 246 70 130mm*110mm RLC Minimum Package Size Minimum device pin spacing Welding mode 0402 0.65 Reflow soldering for double sides+ Wave soldering Manufacturing process PCB producing+components procurement+assembly

Product Details
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