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Manufacturing Capabilities
  • PCB Manufacturing Capabilities 1
    Layer count 1-60 Layers
    Min outer line width/space 3/3mil
    Outer copper thickness 280um(8OZ)
    Inner copper thickness 210um(6OZ)
    Tolerance of PCB thickness board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
    board thickness>1.0mm; ±10%
    Minimum PTH Mechanical hole 4mil, laser 3mil
    Material FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
    HDI Levels 2-7
    Special Process Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling,
    buried resistance,buriedcapacitance, milling steps, multi-combination impedance;
  • SMT Manufacturing Capabilities 1
    SMT capacity 10 million solder joints/day
    SMT production line 8
    Surplus Resistance and capacitance: 0.03%,IC: 0%
    Board type POP/PCB/FPC/Rigid-flex board/HDI/High Frequency&SpeedPCB/Metal-PCB
    Mounting component precision Minimum package: 03015CHIP/0.20PLT
    Minimum Component Accuracy:±0.034MM
    IC placement accuracy: ± 0.025MM
    PCB size 50*50MM~774*710MM
    PCB thickness 0.3~6.5MM