1. Please upload the Gerber & BOM Files and board making instructions
2. The uploaded file format supports ZIP, RAR, 7Z compression package, less than 50MB
1. Please upload the Gerber Files and board making instructions
1. Please upload the BOM Files
Explore bqpwb’s advanced drone PCB boards designed for UAV electronics. Our high-performance PCBs ensure reliability and efficiency for a wide range of drone applications. Discover how our solutions meet the latest demands in drone technology.
PRODUCT FEATURES Product Name: PCBA Board Assembly Silkscreen Color: White, Black, Yellow Testing: 100% E-test Lead Time: 3-5 Working Days Max. Panel Size: 600mm*1200mm Certifications: ISO9001, ISO14001, UL, RoHS Electronic Circuit Board Assembly PCBA Boa
Product Details
Serial Project Product data 1 Application Automotive Electronics 2 Characteristic / 3 Material FR-4(TG170)shengyiFR-4(TG170) 4 Layer 10L 5 Thickness 2.81mm 6 Min hole diameter 0.25mm 7 /Min width/space 5/5mil 8 Surface finish Immersion Tin 9 Internal # C4
Serial Project Product data 1 Application Communication 2 Characteristic / 3 Material R04350BRogers R04350 4 Layer 6L 5 Thickness 1.65mm 6 Min hole diameter 0.3mm 7 /Min width/space 7.8/5.8mil 8 Surface finish 2UImmersion gold 2U 9 Internal # /
Serial Project Product data 1 Application Medical instruments 2 Characteristic Halogen-free board 3 Material (TG170Halogen-free board(TG170 4 Layer 12L 5 Thickness 1.6mm 6 Min hole diameter 0.15mm 7 /Min width/space 3.5/3mil 8 Surface finish 2UImmersion g
Serial Project Product data 1 Application Semiconductor testing 2 Characteristic (5U)Fully Gold Plated(5U) 3 Material FR-4(TG170)shengyiFR-4(TG170) 4 Layer 28L 5 Thickness 6.35mm 6 Min hole diameter 0.5mm 7 /Min width/space 5/5mil 8 Surface finish Gold Pl
Serial Project Product data 1 Application Semiconductor testing 2 Characteristic / 3 Material FR-4shengyiFR-4 4 Layer 14L 5 Thickness 2.4mm 6 Min hole diameter 0.2mm 7 /Min width/space 8/8.62mil 8 Surface finish Gold Plated 9 Internal # /
Serial Project Product data 1 Application Power Module 2 Characteristic cavity board machine blind and bury 3 Material FR-4(TG170)shengyiFR-4(TG170) 4 Layer 10L 5 Thickness 4.8mm 6 Min hole diameter 1.1mm 7 /Min width/space 5.9/4mil 8 Surface finish Gold
Serial Project Product data 1 Application Computer application 2 Characteristic (15U)Gold Plated (15U)fingerImmersion gold 3 Material FR-4(TG150)shengyiFR-4(TG170) 4 Layer 6L 5 Thickness 1.2mm 6 Min hole diameter 0.2mm 7 /Min width/space 7.8mil/5.6mil 8 S
Serial Project Product data 1 Application Module power supply 2 Characteristic 4OZCopper Thickness 4OZ 3 Material FR-4(TG170) 4 Layer 14L 5 Thickness 4.93mm 6 Min hole diameter 0.3mm 7 /Min width/space 8mil/8mil 8 Surface finish Immersion Gold 9 Internal
Serial Project Product data 1 Application Module power supply 2 Characteristic 4OZ4OZ Copper Thicknessmachine blind and bury VIA, high copper thickness coil 3 Material FR-4(TG170)shengyiFR-4(TG170) 4 Layer 14L 5 Thickness 3.2mm 6 Min hole diameter 0.2mm 7
Serial Project Product data 1 Application Data acquisition 2 Characteristic / 3 Material FR-4(TG170) shengyiFR-4(TG170) 4 Layer 14L 5 Thickness 2mm 6 Min hole diameter 0.25mm 7 /Min width/space 3mil/3mil 8 Surface finish (2U)Immersion Gold(2U) 9 Internal
Serial Project Product data 1 Application RF Antenna 2 Characteristic (30U)Fully Gold Plated(30U) 3 Material 4350BRogers4350B 4 Layer 4L 5 Thickness 2.5mm 6 Min hole diameter 0.25mm 7 /Min width/space 6mil/6mil 8 Surface finish Gold Plated 9 Internal # S2
Serial Project Product data 1 Application Semiconductor testing 2 Characteristic (2U)Fully Gold Plated(2U) 3 Material FR-4(TG170)shengyiFR-4(TG170) 4 Layer 16L 5 Thickness 3.60mm 6 Min hole diameter 0.25mm 7 /Min width/space 2.5mil/2.5mil 8 Surface finish
Serial Project Product data 1 Application Medical equipment 2 Characteristic / 3 Material TU-872slkTU-872slk 4 Layer 14L 5 Thickness 2mm 6 Min hole diameter 0.2mm 7 /Min width/space 4mil/4mil 8 Surface finish (2U)Immersion Gold(2U) 9 Internal # C758070C14
Serial Project Product data 1 Application Speed computer card 2 Characteristic +Mix Hi-RF and Hi-speed material 3 Material TU-872SLK+RO4350b TU-872SLK+RO4350b 4 Layer 16L 5 Thickness 1.80.1mm 6 Min hole diameter 0.20mm9:1Mechanical hole 0.20mm. Aspect rat
Serial Project Product data 1 Application /optical module 2 Characteristic 400Goptical module board 3 Material RO5880 4 Layer 10L 5 Thickness 1.6mm 6 Min hole diameter 0.15mm 7 /Min width/space 0.15mm 8 Surface finish Gold Plated
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